Austin, TX

Austin, TX-Smaller, thinner and lighter designs for a host of communications, computer and other electronics products are said to be possible for board assemblies using Ultra CSP packages, a joint development effort between XeTel Corp., a provider of turnkey solutions for manufacturing electronic card and system level assemblies, and Flip Chip Technologies, a producer of flip chips and chip scale packaging. XeTel can design, prototype and assemble pc board assemblies with Ultra CSPs as well as other chip scale packages. The Ultra CSP package is a die-size package that provides board space savings. The companies' qualification board utilizes 0.65 mm Ultra CSPs.