These ball grid array (BGA) test sockets are surface-mount packages with solder balls attached to the bottom surface. When heated, the balls melt and reflow to attach the package to the board. These sockets are for test applications where reduced signal distortion is required. Designed to accept high-pin-count packages typically on 0.050" spacing, the modules utilities fuzz-button and Hardhat contact pins to offer highly reliable electrical characterization and test results. The test sockets provide virtually invisible interconnection.
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