Electronic Design

Chip Maker Moves To Leadfree Packaging

With the European ban on lead in electronics looming, Fairchild Semiconductor has begun moving all of its products to packages with leadfree (Pb-free) finishes. This changeover is expected to be done by June of next year.

For customers migrating to leadfree pc-board assembly using leadfree solders, the use of leadfree components on their boards will help them to comply with the European Union's directive on the Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). Effective July 1, 2006, RoHS bans the use of materials such as lead, mercury, and cadmium in electronic products sold in Western Europe.

In addition, Fairchild's leadfree packaging will aid compliance with the Waste Electrical and Electronic Equipment (WEEE) directive. WEEE requires companies that sell electronic products in Europe to set up collection and recycling systems for these goods at end-of-life by August 13, 2005. By adopting, leadfree assembly, companies selling into Europe can reduce the need for collection and recycling.

Fairchild's leadfree packages will also meet or exceed the requirements of J-STD-020B. This joint IPC/JEDEC standard defines the requirements for certifying the moisture sensitivity level of devices with lead-free finishes.

For more information, send inquiries to [email protected] or go to www.fairchildsemi.com.

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