This line of ball-grid-array cooling products offers scalability with respect to thermal performance. The heatsink options include the firm's Push-Pin attachment technology, stronger double-sided tape, and low-profile, 40 x 40 x 7-mm fans. In addition to its existing plastic Push-Pins, brass Push-Pins are now also available. The pins use a standard 3.12-mm diameter hole pattern that accommodates future cooling requirements without need for board redesign. Heatsinks that can cool up to 4W and 15W are available.