EE Product News

EMI Gaskets Form In Place

The ElectroForm Series 8558 compounds are form-in-place EMI gaskets that provide more packaging space for board-level components and smaller package dimensions. Filled with proprietary conductive particles, they provide shielding effectiveness of >120 dB at 1 GHz. Because they do not need mixing, ElectroForm compounds shorten production cycles and reduce waste. The compounds cure quickly at normal room temperature and humidity, eliminating the need for costly heat curing systems and permitting use of inexpensive plastic or metal substrates. They also adhere to aluminum and other cast alloys, stainless-steel, nickel-copper plating over plastics, and copper-, silver-, and nickel-filled paint or plastics.


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