Encapsulant Suits SMT Applications

March 1, 2001

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The 3534 liquid epoxy, glob-top encapsulant is said to be particularly well-suited for chip-on-board applications involving components that do not offer potting indentations. The epoxy offers controlled flow and can penetrate through wire leads.
The encapsulant cures in 30 minutes at 150°C and is designed to minimize stress, resist chemicals, and improve temperature cycling performance.

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