EE Product News

Encapsulant Suits SMT Applications

The 3534 liquid epoxy, glob-top encapsulant is said to be particularly well-suited for chip-on-board applications involving components that do not offer potting indentations. The epoxy offers controlled flow and can penetrate through wire leads.
The encapsulant cures in 30 minutes at 150°C and is designed to minimize stress, resist chemicals, and improve temperature cycling performance.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.