System designers can increase memory density without compromising bandwidth with what's claimed as the industry's first x32-bit and x64-bit configuration, 256-Mbit SDRAMs using the firm's Multi-Chip Packaging technology. The single package implementation allows designers to save some 70% of the board space in applications that would typically use four pieces of 4M x 16, 64-Mbit SDRAMs in TSOP packages. The combination of high density, wide configuration, small footprint and low price make the devices suitable for notebook PCs and handheld systems. They also transfer data at 800 Mbyte/s for applications that require faster throughput such as telecommunication systems.
Company: HITACHI SEMICONDUCTOR AMERICA INC.
Product URL: Click here for more information