EE Product News

IC Provides High Bandwidth Communications Paths

Designed to provide high bandwidth communications paths for multiple processors and I/O modules, the new Solano Communications IC contains four full-duplex high-speed LVDS links with an aggregate bandwidth of over 12.8 Gb/s per node. A data network implemented with this IC provides system throughput that can be many times higher than that offered by conventional bused or serial link communications, the company says.
Targeted at 3G wireless and broadband base stations, the Solano IC is typically connected to the external memory interface bus of a DSP or other signal processing device. Its high-speed serial links can connect to other Solano ICs, I/O modules or processor nodes that are on or off the carrier board.


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