EE Product News

Interconnects' Design Is Variable In Three Planes

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These products ar designed to achieve high density by letting users specify the number of rows, pins per row and board spacing using standard interconnect designs. Headers, board stackers, sockets and self-nesting sockets are available using these three-plane variations. Up to 310 pins per square inch on 0.050" pitch can be fabricated with BGA processing compatibility. Solder balls can be attached optionally for reflow soldering. The proprietary metal washer technology allows one-pass IR soldering of high density interconnects. The products meet PC/104 and PC/104 Plus specs.

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