EE Product News

Low-Profile Microprocessor Socket Offers Solderless Connections

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The MicroConn microprocessor socket features a high-density 1.27 mm and 1.12 mm pitch and solderless connection to microprocessor, ASIC, and other large packages. The socket is touted as a replacement for BGA and pin-type connectors and optional SMT solder configuration is available for direct soldering to pc boards. Other features include a short contact length that yields low inductance at high frequencies.

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