Low-Profile Microprocessor Socket Offers Solderless Connections

Sept. 1, 2000

The MicroConn microprocessor socket features a high-density 1.27 mm and 1.12 mm pitch and solderless connection to microprocessor, ASIC, and other large packages. The socket is touted as a replacement for BGA and pin-type connectors and optional SMT solder configuration is available for direct soldering to pc boards. Other features include a short contact length that yields low inductance at high frequencies.

Sponsored Recommendations

What are the Important Considerations when Assessing Cobot Safety?

April 16, 2024
A review of the requirements of ISO/TS 15066 and how they fit in with ISO 10218-1 and 10218-2 a consideration the complexities of collaboration.

Wire & Cable Cutting Digi-Spool® Service

April 16, 2024
Explore DigiKey’s Digi-Spool® professional cutting service for efficient and precise wire and cable management. Custom-cut to your exact specifications for a variety of cable ...

DigiKey Factory Tomorrow Season 3: Sustainable Manufacturing

April 16, 2024
Industry 4.0 is helping manufacturers develop and integrate technologies such as AI, edge computing and connectivity for the factories of tomorrow. Learn more at DigiKey today...

Connectivity – The Backbone of Sustainable Automation

April 16, 2024
Advanced interfaces for signals, data, and electrical power are essential. They help save resources and costs when networking production equipment.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!