EE Product News

Pin-And-Socket Connectors Increase Interconnect Density

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The company's latest micro pin-and-socket connectors on 0.0315'' and 0.0394'' pitch have been designed to increase interconnect density for small form factor, micro/miniature applications without sacrificing the electrical and mechanical benefits of traditional pin-and-socket construction. The 0.012'' square terminals mate with dual beam Tiger Claw contacts or single beam Tiger Beam contacts. Both are suited for pass through applications. The 0.0315'' system includes headers (FTE Series) and stackers (AW Series), which create board spacings from 0.0197'' to 0.355'' when mated with CLE Series surface mount sockets. The dual row interconnectors have up to 90 pins per row for pinout densities as high as 350 per square inch of board space. The 0.0394'' pitch system also includes headers (FTM Series) and stackers (MW Series) with board spacings from 0.137'' to 0.365'' when mated with CLM or MLE Series sockets. Both systems include right-angle headers for perpendicular board interface applications. Pricing begins from $0.08 to $0.10 per mated line. SAMTEC, New Albany, IN. (800) 726-8329.

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