EE Product News

Thermal Ware Focuses On Design Integration

In its latest version, Icepak 3.2 cooling simulation software provides new user options for reading files to and from CAD and other DAE. In addition to having a choice of using a direct CAD interface, the software now offers a general-purpose IGES interface and the ability to import files in the IDF format used by Mentor Graphics, Cadence, and Zuken. This allows users to import their printed circuit board layouts for thermal analysis and integration with the system-level design in the program. For computerized thermal, stress, and mechanical analysis, data from the software can be exported into Nastran, Patran, and IDEAS Universal files. Other enhancements include an improved shell conduction model that can solve problems containing thin plates and complex geometries, such as printed circuit boards (PCBs), clamshell housings, honeycomb heat sinks, and BGA packages. A number of macros for head sinks, PCBs, packages, solar flux, and others round out the list of new features. Entry level pricing is $20,000. FLUENT INC., Lebanon, NH. (603) 643-2600.

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