EE Product News

Water Soluble Solder Paste Resists Humidity

Formulated to endure the rigors of high-speed printing processes, the Multicore OA21HT non-hydroscopic, water-soluble solder paste promises to reduce slump and bridging concerns. Available in lead-free alloy formulations, the paste offers open times in excess of 24 hours, a wide printing operating window, and expanded resistance to humidity at the printer. Other features include the ability to solder difficult board finishes and surfaces and the ability to withstand elevated reflow temperatures. LOCTITE AMERICAS, Rocky Hill, CT. (800) 527-4549.


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