EE Product News

Broadcom Introduces First 3G Phone On A Chip

Reportedly ahead of its time, the BCM21551 HSPA processor integrates all key 3G cellular and mobile technologies on a single 65-nm CMOS die. Described as a 3G phone on a chip, the device integrates a high-speed HSUPA 3G baseband, multi-band RF transceiver, Bluetooth 2.1 with enhanced data rate technology, an FM radio receiver, and an FM radio transmitter. It also features advanced multimedia processing, up to five Mpixel camera support, 30 fps video with TV out, and support for the HSUPA, HSDPA, WCDMA, and EDGE protocols. The BCM21551 integrates dual ARM11 processors to provide open OS support, stereo music capabilities for both headset and stereo speakers, a five-band graphic equalizer, digital mixing capabilities, and MIPI serial interfaces. Price for the BCM21551 is $23 each in large quantities. BROADCOM CORP., Irvine, CA. (949) 926-5000.


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TAGS: Mobile
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