Bus Interface/Backplane Chips Transfer Data At 1.6-Gb/s Pace

May 1, 2001
Said to be the industry's fastest bus interface and backplane chips, the ComL series of ICs is designed to operate at data transfer rates up to 1.6 Gb/s. The series includes multiplexed differential line drivers with redundant links for serial

Said to be the industry's fastest bus interface and backplane chips, the ComL series of ICs is designed to operate at data transfer rates up to 1.6 Gb/s. The series includes multiplexed differential line drivers with redundant links for serial backplanes, 20-bit tri-state buffers, and clock-distribution buffers with fanouts of 1:10, 1:8 and 1:4. Inputs may be configured as LVCMOS, LVDS and regular differential. The LVDS output drivers are configurable to support standard drive times (i.e., 2 ns for both rise and fall) and high drive times (<500 ps for rise and fall). The multiplexed differential line drivers support clock speeds up to 800 MHz and use the LVDS interface of inputs and outputs. The devices are sampling now, with prices ranging from $3.50 to $14.10 each/1,000.

Company: CYPRESS SEMICONDUCTOR CORP.

Product URL: Click here for more information

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