EE Product News


GPS CHIPSET- Joint development of a global positioning systems (GPS) chipset will be undertaken by Leica Geosystems Inc., Torrance, CA, and IBM's Microelectronics Div. IBM plans to market the chipset as a low-cost, low-power GPS implementation for commercial and consumer systems. The agreement allows IBM to combine its SiGe process technology with Leica's GPS design expertise. Initial product plans include a single-chip civilian code receiver, made possible in part by the use of SiGe to integrate what had been separate components. Production quantities are planned for the first quarter of 1999.

Company: IBM - Microelectronics Division

Product URL: Click here for more information

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