GPS CHIPSET- Joint development of a global positioning systems (GPS) chipset will be undertaken by Leica Geosystems Inc., Torrance, CA, and IBM's Microelectronics Div. IBM plans to market the chipset as a low-cost, low-power GPS implementation for
GPS CHIPSET- Joint development of a global positioning systems (GPS) chipset will be undertaken by Leica Geosystems Inc., Torrance, CA, and IBM's Microelectronics Div. IBM plans to market the chipset as a low-cost, low-power GPS implementation for commercial and consumer systems. The agreement allows IBM to combine its SiGe process technology with Leica's GPS design expertise. Initial product plans include a single-chip civilian code receiver, made possible in part by the use of SiGe to integrate what had been separate components. Production quantities are planned for the first quarter of 1999.
