A new DCB isolated package called the ISOPLUS i4-PAC has a 269 mm2 DCB substrate and is able to hold multi-chips in various circuit topologies. The package can have up to five pins and allows the user to build low-cost, compact circuits. Examples are phase-legs with two IGBTs plus two free wheel diodes in one single housing, buck and boost choppers with FREDs and IGBTs or MOSFETs, dual packs or ac controllers with thyristors, or single-phase and three-phase rectifier bridges. The advantages of this package over conventional discrete TO-247 and TO-264 packages are: patented backside isolation up to 2,500V; higher thermal conductance junction-to-heatsink; and increased long term reliability, due to its load-cycle capability. Plus it allows the construction of more compact power conversion equipment resulting in lower stray inductances, better EMC immunity and lower cost. The package can be mounted directly to a heatsink with spring clips without any additional isolation material, which also enhances heat transfer.
Company: IXYS CORP.
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