The RoadLINK chipset, jointly developed by NXP and Cohda Wireless, has found its way into the MK4, the latest generation of car anti-collision technology using vehicle-to-vehicle (V2V) and vehicle-to-infrastructre (V2I) implementations (referred to as V2X). Building on the success of the MK3 unit, used in V2X trials worldwide, the MK4 will serve as the reference design for series-production of the first generation of connected vehicles, expected to launch in 2015. The initial chipset, integrated with all of NXP’s multi-standard software-defined radio technology, cuts the MK4 to half the size of its predecessor. The RoadLINK chipset exchanges messages reliably across an extended range. At high speed, it reduces “time to react” and communicates potential hazards and safety-critical scenarios significantly faster than conventional applications. Supporting both DSRC (IEEE 802.11p) and Wi-Fi (802.11abgn) wireless standards, the RoadLINK chipset can upload and access data via Wi-Fi. It supports international standards including IEEE 1609 for U.S. operation, ETSI TC-ITS for European use, and the Japanese standard at 760 MHz (ARIB STD-T109). A software development kit is available.