EE Product News

Thin-Film Chip Attenuators Target RF Apps

Suited for use in RF applications such as base stations and antennas, as well as in microwave applications for use in power dividers and power amps, this new line of high reliability, thin film chip attenuators in new available in the industry-standard case size of .075" x .060" x .010". The new device size comes in four termination styles. Metallization options include solderable, epoxy bondable and wire bondable types. The chip attenuators are constructed with an alumina body, and a proprietary thin film resistor element for optimum performance. The devices are available with attenuation factors of 1 to 20 dB in 1/2 dB increments. They are rated at 50V maximum voltage and .125W max. power.


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