EE Product News

xDSL Line Driver Boasts Of Major Reduction In Power Dissipation

The AD8016 xDSL line driver is said to achieve operational efficiencies that far exceed that available from competitive devices. The resulting lower power dissipation is expected to lead to the development of higher density telecomm line cards- and, therefore, increased port densities- as well as greater signal reach and lower system costs.The firm tapped a new amplifier architecture, fab process and power-down mode to bring about the AD8016’s dramatic improvement in efficiency. The new architecture allows the output stage to drive closer to the power supply rail while still delivering the low-distortion drive current required by ADSL. This allows system designers to use ±12V rather than ±15V supplies, greatly reducing the headroom needed to provide the same output voltage. The second factor contributing to AD8016’s higher efficiency is a faster, 26V bipolar fab process that allows the chip to hit its distortion and bandwidth targets on less static quiescent current. Together, the new architecture and fab process have reduced power dissipation for this second-generation chip by a whopping 32% compared to first-generation parts. Power dissipation is further lowered by use of a flexible power-down capability that allows the line driver to be turned down or off along witht the rest of the chip.The AD8016 line driver comes in 20-pin PSOP and 24-pin SOIC packages. Both packages are specified over a -40°C to 85°C temperature range.


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