The workhorse of the company’s advanced digital imaging solutions, backside illumination (BSI) technology enters its second generation with the introduction of the market’s first 1.1-µm BSI pixel. The OmniBSI-2 pixel architecture forecasts imaging solutions with superior image quality and low-light sensitivity while extending the company’s pixel roadmap to sub-micron levels, a key enabler in the continuous miniaturization of imaging technology. The technology is reportedly the first pixel built on a 300-mm copper process at 65 nm design rules, developed in cooperation with Taiwan Semiconductor Manufacturing Company. Combining custom 65-nm design rules and unique manufacturing process modules, the 1.1-µm pixel achieves new depths of low-light sensitivity as well as significantly reduced dark current and full-well capacity. For further details, call OMNIVISION TECHNOLOGIES INC., Sunnyvale, CA. (408) 542-3000.