Electronic Design

BSI Pixel Technology Enters Second Generation

The workhorse of the company’s advanced digital imaging solutions, backside illumination (BSI) technology enters its second generation with the introduction of the market’s first 1.1-µm BSI pixel. The OmniBSI-2 pixel architecture forecasts imaging solutions with superior image quality and low-light sensitivity while extending the company’s pixel roadmap to sub-micron levels, a key enabler in the continuous miniaturization of imaging technology. The technology is reportedly the first pixel built on a 300-mm copper process at 65 nm design rules, developed in cooperation with Taiwan Semiconductor Manufacturing Company. Combining custom 65-nm design rules and unique manufacturing process modules, the 1.1-µm pixel achieves new depths of low-light sensitivity as well as significantly reduced dark current and full-well capacity. For further details, call OMNIVISION TECHNOLOGIES INC., Sunnyvale, CA. (408) 542-3000.
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