Electronicdesign Com Products Components Coolers Tout High Heat Pumping Capacity26471
Electronicdesign Com Products Components Coolers Tout High Heat Pumping Capacity26471
Electronicdesign Com Products Components Coolers Tout High Heat Pumping Capacity26471
Electronicdesign Com Products Components Coolers Tout High Heat Pumping Capacity26471
Electronicdesign Com Products Components Coolers Tout High Heat Pumping Capacity26471

Coolers Tout High Heat Pumping Capacity

June 1, 2002
The High Power Density cooling series includes a new class of thermoelectrics designed to do the work of much larger or multiple units. The thermoelectrics have a strong, porch-style lead attachment design and a high heat pumping capacity. Of course,

The High Power Density cooling series includes a new class of thermoelectrics designed to do the work of much larger or multiple units. The thermoelectrics have a strong, porch-style lead attachment design and a high heat pumping capacity. Of course, they also enjoy the same solid-state reliability as other thermoelectric modules. Available in both standard and high temperature models, the cooling devices offer heat pumping densities of up to 11.5 W/cm_, said to be double the heat pumping capabilities of standard thermoelectrics. Applications for the High Power Density series include cooling high-powered ICs, lasers, and industrial equipment. For more information, contact Kathy Salvatore at MELCOR, Trenton, NJ. (609) 393-4178.

Company: MELCOR

Product URL: Click here for more information

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