Heat Sinks Shine In Low Airflow Conditions

March 21, 2006
Designed for cooling BGAs and other components under restricted airflow conditions, the maxiFLOW heat sinks feature a low profile, spread-fin array that maximizes surface area for more effective convection cooling. The components are fabricated from

Designed for cooling BGAs and other components under restricted airflow conditions, the maxiFLOW heat sinks feature a low profile, spread-fin array that maximizes surface area for more effective convection cooling. The components are fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight, and reportedly keeps costs low. Tested using an airflow rate of 100 lfm, they reduce junction temperatures by more than 40% in comparison to similar extruded heat sinks. The MaxiFLOW heat sinks are available in lengths and widths ranging from 10 mm x 10 mm to 60 mm x 60 mm, and heights starting at 2 mm. Pricing begins at $2.50 each in production quantities. ADVANCED THERMAL SOLUTIONS INC., Norwood, MA. (781) 769-2800.

Company: ADVANCED THERMAL SOLUTIONS INC.

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!