Groomed for space-constricted designs, the maxiFLOW IC heatsinks feature a spread fin array that maximizes surface area for more effective convection cooling. Standard sink heights are as low as 9.5 mm. Fabricated from extruded aluminum, the heat sinks using an airflow rate of 100 lfm can reduce device junction temperatures by more than 40% below that of comparable heatsinks. Pricing for the maxiFLOW heat sinks starts at less than $10 each including mounting hardware and phase-change thermal interface material. ADVANCED THERMAL SOLUTIONS INC., Norwood, MA. (781) 769-2800.
