A line of hybrid pin-fin heat sinks are made from an array of forged aluminum pin-fin heat sinks that are reflowed onto a copper plate. The hybrid pin fins are available in a wide array of standard sizes, with footprints as large as 8.2 in. x 8.2 in. The combination of the forging and reflow manufacturing technologies enables the creation of large-footprint pin-fin heat sinks that cannot be manufactured using only the forging technology. Due to their unique structural configuration, hybrid pin-fin heat sinks possess the heat spreading properties of all copper heat sinks, yet are substantially lighter in weight and therefore suitable for applications that require the heat-spreading capabilities of copper heat sinks without the associated weight constraints. Hybrid pin fins range in footprint from 1.5 in. x 3.0 in. to 8.2 in. x 8.2 in. and in height from 0.3 in. to 1.3 in. In terms of overall weight, hybrid pin fin heat sinks are up to 50 percent lighter than identically structured copper pin fin heat sinks. Hybrid pin-fin heat sinks fit any application requiring large sized, low profile, efficient cooling solutions. They are highly suitable for "hot" semiconductors, multi-device cooling in cutting-edge surface mount environments, and for embedded applications. COOL INNOVATIONS INC., Toronto, Canada. (905) 760-1992.
Company: COOL INNOVATIONS INC.
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