These die-cut, thermally-conductive, adhesive-containing pads are designed to transfer heat from a µP or other semiconductor to a heatsink and to also attach these two parts together. A designed-in tab provides ease of assembly and installation, and an easy-to-remove cover protects the adhesive-the aluminum oxide-filled acrylic adhesive is coated onto a 0.002" thick aluminum foil with its easy-to-release film protector. The material's dimensional tolerance is ±0.010".
Company: PRESSCUT INDUSTRIES
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