Thermoelectric Assemblies Enter Next Generation

Thermoelectric Assemblies Enter Next Generation
Dec. 17, 2009
Featuring a compact design with higher cooling performance and less power consumption, the next gen Tunnel Series thermoelectric assemblies employ patented cross flow technology to boost heat transfers when pulling air through a heat exchanger. Heat is absorbed and dissipated through a high density heat sink with sheet metal shrouds and fans. The components are available in two configurations: air-air using convection cooling to absorb and dissipate heat via heat exchangers with fans and direct-air conduction cooling to absorb heat through a cold plate. LAIRD TECHNOLOGIES THERMAL PRODUCTS, Cleveland, OH. (888) 246-9050.

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sign up for our eNewsletters
Get the latest news and updates

Voice Your Opinion!

To join the conversation, and become an exclusive member of Electronic Design, create an account today!