Underfill Suits POP Assembly

Jan. 12, 2012
CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies.

CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies.  It has low viscosity and a lower CTE than its predecessors plus greater flux compatibility, making it suitable for use with a broader range of solder pastes and tacky fluxes. Features include a viscosity of 650 cps and a CTE of 55 ppm/°C. ZYMET INC., East Hanover, NJ. (973) 428-5245.

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!