EE Product News

Logic Devices Housed In Thin BGA Package

Offered as the industry's first logic devices to be available in an ultra-thin MicroStar Junior BGA package, the LVC series is said to be 70% to 75% smaller than current thin-scale, small-outline TSSOPs. The BGA packages have a 31.5 mm2 footprint and a height of 1 mm. The solder balls have a ball pitch of 0.65 mm and a diameter of 0.4 mm. Said to provide improved electrical performance over comparable solutions, the inductance and capacitance performance of these packages is also claimed to be 30% to 50% better then other TSSOP packages. Prices range from $2.39 to $3.80 each/1000.

Company: TEXAS INSTRUMENTS INC. - Semiconductor Group, Literature Response Center

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