Thermally Conductive, Low Modulus Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP55TCFL is engineered for applications demanding efficient heat dissipation and electrical insulation. Its small particle filler enables thin bond lines, reducing thermal resistance. The epoxy's service temperature range, flexibility, and compatibility with various substrates make it a reliable choice for thermal management in high-performance electronic and aerospace systems.

Key Highlights

  • Developed to meet NASA low outgassing specifications, ensuring suitability for space applications.
  • Offers a thermal conductivity of 3.2–3.8 W/(m·K) and high volume resistivity for electrical insulation.
  • Available as a two-part system or premixed, with curing options at 50–70°C or 80–90°C for flexibility in processing.
  • Features a low shrinkage, flexible formulation with a Shore D hardness of 55–65, ideal for thermal cycling environments.
  • Adheres to a wide range of substrates including metals, ceramics, composites, and plastics, broadening application scope.

Master Bond EP55TCFL is a thermally conductive, electrically insulating epoxy system developed for bonding, sealing, coating, and small potting applications. It meets NASA low outgassing specifications and incorporates a filler with small particle sizes, enabling application in thin bond lines to minimize thermal resistance. The system is 100% reactive, contains no solvents or diluents, and exhibits low shrinkage upon cure.

The material provides a thermal conductivity of 3.2–3.8 W/(m•K) and a volume resistivity greater than 1014ohm-cm at 25°C. It features a low tensile modulus of 8,000–12,000 psi, an elongation of 10–20%, and a Shore D hardness of 55–65, providing flexibility and thermal cycling capabilities. EP55TCFL is serviceable over a temperature range of -50°C to +125°C and adheres to substrates including metals, composites, ceramics, and many plastics.

EP55TCFL is available as a two part system or as a one part premixed and frozen system. The two part version has a 100:15 mix ratio by weight, a mixed viscosity of 30,000–60,000 cps, and a working life of 2–4 hours for a 100-gram batch at 25°C. It cures with elevated temperature schedules of 4–6 hours at 50–70°C or 3–4 hours at 80–90°C. Packaging options include 1, 4, and 8 ounce jars for the two part formulation, as well as 3 cc, 5 cc, and 10 cc premixed and frozen syringes.

Master Bond Thermally Conductive Adhesives

Master Bond offers an extensive portfolio of thermally conductive adhesive systems formulated for applications where heat dissipation and electrical isolation are essential. Available chemistries include epoxies, silicones, and specialty compounds engineered for use in microelectronics, aerospace, optical, and electronic assembly environments. Formulations provide performance properties such as high thermal conductivity, low thermal resistance, mechanical shock resistance, and thermal cycling capabilities, with select grades meeting NASA low outgassing specifications. To learn more about thermally conductive systems, visit https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact our technical support team to discuss your specific application needs.

TECH SUPPORT
Email: [email protected]
Web: https://www.masterbond.com/contact
Tel: +1-201-343-8983

Note to Editors:

For a full product description, please visit: https://www.masterbond.com/tds/ep55tcfl
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CONTACT
James Brenner, Marketing Manager
Email: [email protected]
Tel: +1-201-343-8983
Fax: +1-201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

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