Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry...
Master Bond EP62-1HTND is a two component epoxy system formulated for bonding and sealing applications requiring high temperature capability and chemical resistance, particularly...
Master Bond EP55TCFL is engineered for applications demanding efficient heat dissipation and electrical insulation. Its small particle filler enables thin bond lines, reducing...
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature ...
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and...
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room ...
The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance...
For over 50 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched...
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing. Key Features Thermal conductivity exceeds 6...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest...
