Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry.
154 Hobart Street Hackensack, NJ 07601 United States
Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable systems are reliable, come in convenient packaging and feature outstanding performance properties.
More Info on Master Bond
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Master Bond formulates high quality, innovative compounds for the assembly of semiconductor, electronics, energy, printed circuit board assemblies, and battery applications, specializing in conformal coatings, glob tops, flip chip underfills, and die attach materials. Our expansive line of epoxies, silicones, UV curable and LED curable compounds can be customized to meet a wide range of property requirements.
Performance Properties of Master Bond Adhesives, Sealants and Coatings
Specific compounds can be formulated to provide thermal management, heat transfer, thermal conductivity for pcb assembly, battery applications, sensors and components. Other formulations may provide EMI/RFI shielding, conformal coating, and encapsulants that protect against heat, moisture, contamination, vibration and shock. Yet other polymers may offer optical clarity, such as UV curables for opto-electronic applications.
Master Bond MasterSil 981-LO is a two-component silicone designed for high performance bonding, sealing, and encapsulating applications. It does not require air for curing. The...
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing. Key Features Thermal conductivity exceeds 6...
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
Master Bond EP62-1HTND is a two component epoxy system formulated for bonding and sealing applications requiring high temperature capability and chemical resistance, particularly...
Master Bond EP55TCFL is engineered for applications demanding efficient heat dissipation and electrical insulation. Its small particle filler enables thin bond lines, reducing...
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature ...
The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance...
For over 50 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched...
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...
Master Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster cure. It can bond to...
Master Bond UV11-3 is a hard, super-abrasion-resistant coating system for various substrates. It can be cured readily by ultraviolet (UV) exposure at around 325-365 nm either ...
Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications (ASTM ...
Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature...
A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and...
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require ...
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room ...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest...
December 19, 2025 - Hackensack, NJ - Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This...
MasterSil 800Med is a one component, moisture curing silicone specifically designed for medical device manufacturing. It passes ISO 10993-5 testing for non-cytotoxicity, confirming...
Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This unique "side-...
Master Bond formulates high-quality, innovative compounds for the laser, optics, and photonics industries. Our goal is to help engineers meet specific requirements for their bonding...
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically...
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ...
