Materials & Packaging

Featured Companies

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry...
Mouser is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its manufacturing partners for electronic design engineers...

Featured Content

Courtesy of Master Bond
Supreme 17HTMed
Supplier Submitted
Master Bond Supreme 17HTMed is a one component, toughened epoxy system formulated for bonding and sealing across medical device applications. This single component material requires...
Supplier Submitted
Wakefield Thermal SFA Skived Fin Heat Sink Assemblies feature 60mm and 120mm fan configurations with push and push-pull designs. Wakefield Thermal SFA Skived Fin Heat Sink Assemblies...
Supplier Submitted
New Energy NEHS-ERP Custom Heat Sinks are industry-leading high-powered thermal solutions for TWM, TWC, SWM, SWC, and AWM light modules. These heat sinks are manufactured from...
Supplier Submitted
New Energy NELM TIM Thermal Pad is an industry-leading high-powered thermal solution designed for use with NELM light modules. This thermal pad features a 3W/m·K thermal...
Supplier Submitted
Keystone Electronics Metric Standoffs are threaded standoffs ranging from 2.00mm to 8.00mm in height with an M2.5 thread and a 5.10mm outer diameter. Keystone Electronics Metric...
Courtesy of Master Bond
ep621htnd
Supplier Submitted
Master Bond EP62-1HTND is a two component epoxy system formulated for bonding and sealing applications requiring high temperature capability and chemical resistance, particularly...
Supplier Submitted
How to Tackle Modern Thermal Design Challenges for Fanless-Edge Compute
Supplier Submitted
On September 9, 2026 in Computing by Mike Parks Desktop printed circuit board (PCB) manufacturing is reshaping how hardware is developed and prototyped. The formerly rigid and...
Courtesy of Master Bond
Master Bond EP55TCFL
Supplier Submitted
Master Bond EP55TCFL is engineered for applications demanding efficient heat dissipation and electrical insulation. Its small particle filler enables thin bond lines, reducing...
Supplier Submitted
TE Connectivity's SNGS Low Hardness Conductive Elastomers are Silicone Nickel Graphite Soft (SNGS) material engineered to provide effective EMI shielding and environmental sealing...
Supplier Submitted
Tark Thermal Solutions PowerCycling PCX-DG Thermoelectric Coolers are designed for thermal cycling between multiple temperature set points.
Supplier Submitted
Amphenol FCI BASICS Liquid Cooling Leakage Detection Cables are leak detection sensor cable assemblies designed to identify coolant leakage in liquid-cooled thermal management...
Supplier Submitted
Sanyo Denki San Ace 52 9RA 52mm x 15mm Low Noise DC Fans deliver efficient cooling for low-power-consumption equipment such as medical devices and inverters.
Supplier Submitted
Laird Tgrease™ 3000 Thermal Grease supports the growing demand for higher operating temperatures, especially for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors...
Supplier Submitted
PEM BF™ and BFS™ Fine Finish Self-Clinching Blind Nuts feature a bur-free design that delivers a cleaner conductive surface and higher dielectric breakdown margin.
Supplier Submitted
Advanced Thermal Solutions NVIDIA® Jetson Heat Sink Hardware Kits ensure dependable thermal management, secure installation, and enhanced thermal interface performance for ATS...

Latest Content

Courtesy of Shenzhen I-Tech Electronics Co., Ltd.
Busbar FPC
Courtesy of Shenzhen I-Tech Electronics Co., Ltd.
Rigid-flex PCB
Courtesy of Shenzhen I-Tech Electronics Co., Ltd.
Flexible PCB (FPC)
Courtesy of Varnek Busbar Co., Ltd.
Varnek Busbar Co, Ltd
Courtesy of Varnek Busbar Co., Ltd.
Varnek Busbar Co, Ltd
Courtesy of Varnek Busbar Co., Ltd.
Varnek Busbar Co, Ltd
Courtesy of Master Bond
EP64
Courtesy of Master Bond
EP6STC-80