Materials & Packaging

Featured Companies

Mouser Electronics
Mouser Electronics is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its manufacturing partners for electronic design...
Master Bond
Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry...

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Courtesy of Mouser Electronics, Inc.
Wakefield Thermal On-Chip Liquid Cold Plates
Wakefield Thermal On-Chip Liquid Cold Plates support Intel Xeon® processors and provide direct liquid cooling for high-power server CPUs in AI, HPC, and hyperscale data center...
Courtesy of Mouser Electronics, Inc.
Parker Chomerics
July 13, 2026 – Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic...
Courtesy of Mouser Electronics, Inc.
XP Power ASB320 320W Baseplate Cooled Power Modules
XP Power ASB320 320W Baseplate-Cooled Power Modules come with single outputs from 12VDC to 54VDC in a compact, encapsulated brick format.
Courtesy of Master Bond
UV16Med-FD
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
Courtesy of Mouser Electronics, Inc.
Wakefield Thermal Hydro-Air Liquid-to-Air Heat Exchangers
Wakefield Thermal Hydro-Air Liquid-to-Air Heat Exchangers are designed for liquid-to-air thermal management in applications that demand strong heat transfer in a compact footprint...
Courtesy of Master Bond
MasterSil 981-LO
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
Courtesy of Mouser Electronics, Inc.
Mouser Electronics Shipping Wide Selection of Industrial Solutions from Schneider Electric
May 5, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is stocking...
Courtesy of Master Bond
EP64
Two component, vacuum compatible epoxy with convenient handling featuring outstanding temperature and chemical resistance Key Features ·      ...
Courtesy of Master Bond
EP64
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature ...
Courtesy of Master Bond
EP6STC-80
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Courtesy of Master Bond
EP6STC-80
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and...
Courtesy of Master Bond
UV26DCMed
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Courtesy of Master Bond
Master Bond EP3HTSDA-2Med
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room ...
Webinar: How to Select the Right Adhesive for Aerospace Applications
The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance...
About Master Bond
For over 50 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched...
How Do You Use EP4EN-80 for Potting & Encapsulation Applications?
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...

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