The modules integrate a thermistor and an HPS DBC in an F2 package, enabling compact, high-efficiency power-conversion designs. The onsemi NXH011F120M3F2 offers two types of pre-applied thermal interface material and one without pre-applied TIM. The modules also feature press-fit pins and Pb-free, halide-free, and RoHS-compliant construction for power module integration.

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