Lower-Cost LTCC-M Package Handles High-Brightness LEDs

March 31, 2003

Thanks to its proprietary multilayer ceramic-on-metal technology, a high-brightness LED package can offer superior heat dissipation to conventional packages. It costs approximately half that of conventional packages and can withstand high operating temperatures up to 250°C, compared to about 70°C for many conventional plastic packages, due in part to its 170-W/mK thermal conductivity. Developed by Lamina Ceramics, the low-temperature cofired ceramic-on-metal (LTCC-M) package is designed for LED arrays used as replacements for incandescent bulbs, such as traffic signals, automotive, signs and displays, illumination, and backlighting. LED dies may be attached directly to the LTCC-M package via a densely packed array to achieve a light density of up to 840 lumens/in.² Prototypes can be delivered in as little as four weeks.

Lamina Ceramics Inc.
www.lamina.com
(800) 808-5822

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About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.