DSP, µC And Power Management Circuitry Tightly Melded Together In New Generation Of Wireless Chips (1)

Jan. 1, 2001
High performance and long battery life are promised for next-generation wireless communications devices employing chips based on a brand new architecture that melds together digital signal processor, microcontroller and power management circuitry.

High performance and long battery life are promised for next-generation wireless communications devices employing chips based on a brand new architecture that melds together digital signal processor, microcontroller and power management circuitry. Jointly developed by Intel Corp. and Analog Devices Inc., the new, highly-integrated Micro Signal Architecture also integrates dual MACs, dual 40-bit ALUs, and a single barrel shifter in the chips and is supported by a simplified programming model that allows developers to write signal processing and control code in C and C++. In addition, profiling tools are provided for automatically identifying signal processing "hot spots" requiring further optimization by the programmer.
The core architecture also supports dynamic power management. This feature continuously monitors software and enables dynamic adjustments of both the voltage delivered to the core and the frequency at which the core is running to optimize the power delivered for a task. The architecture has also been optimized to process bit streams for multimedia running on battery-powered equipment. Tuned instructions are said to provide up to ten times the performance of other DSPs. The new, easy-to-program DSP architecture is well-suited for processing video, image, voice and data in communications tasks. Developers can access specs and development tools for the new core architecture through the Joint Development Website. Products based on the core will be developed and marketed separately by Intel and Analog Devices, with the first products scheduled to enter the market in early 2001. See "DSP, µC And Power Management Circuitry Tightly Melded Together In New Generation Of Wireless Chips (2)".

Company: ANALOG DEVICES INC.

Product URL: Click here for more information

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!