Standardized DSP/CPU Devices

Sept. 30, 2002
Building an SoC product that combines a DSP and CPU is no easy task. That's why products like TI's OMAP5910 are key to the general use of DSP/CPU architectures. Programming both a DSP and CPU is difficult, but it becomes even harder if communication...

Building an SoC product that combines a DSP and CPU is no easy task. That's why products like TI's OMAP5910 are key to the general use of DSP/CPU architectures. Programming both a DSP and CPU is difficult, but it becomes even harder if communication between the two processors is nonstandard.

The OMAP5910 combines an ARM 925 processor core with a TI TMS320C55x DSP core. It also includes an interprocessor communication system, SDRAM or shared SRAM memory, and four dedicated hardware mailboxes to synchronize data exchanges. Communication between applications on each processor is further enhanced through software support on both sides. The chip has shared and private peripherals to minimize the support chips needed for most applications. A consistent system architecture, interprocessor communication, and a good set of software development tools significantly simplify development.

Other reasons for putting both processors on the same chip include reduced power consumption through better power management. This tends to be more difficult with discrete designs and more complex for custom SoCs. Another benefit of standard dual-processor SoCs is improved debugging. For example, the processor clocks on the OMAP5910 are synchronized so that the pair can be slowed down. There also are hardware breakpoints that can stop both processors, significantly simplifying dual-processor debugging.

See associated figure.

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!