The AALLMetal bonded-fin heatsinks don’t require epoxy or other filler material to attach the fins to the baseplate. The units cool microprocessors and power semiconductors in applications from high-power personal computers and power supplies to traction drives and high-horsepower motor drives.Rather than using an epoxy, the heatsinks are formed using a proprietary technique that locks the fins in place. The result is a high-performance sink that acts as if it were one solid piece of aluminum, with thermal conductivity throughout the part equal to that of a conventional extrusion. The units can be machined, handled and finished as a single-piece aluminum extrusion. The heatsinks are offered in standard size profiles.