Tim Wang-Lee
Tim Wang Lee, Ph.D., is a Signal Integrity Application Scientist at Keysight Technologies, where he develops modeling, simulation, and validation workflows for high-speed digital and chiplet interconnects.
His work focuses on translating emerging interface standards and system requirements into practical engineering methods for channel analysis, electromagnetic modeling, compliance evaluation, and simulation-to-measurement correlation. He works closely with semiconductor, packaging, and system-design teams to address signal-integrity challenges across advanced packaging and printed circuit board environments.
Tim earned his Ph.D. in Electrical Engineering from the University of Colorado Boulder, where his research focused on building confidence in high-speed interconnect models through measurement correlation. He has authored technical papers, industry articles, and educational content on signal integrity and interconnect design, and was recognized as a DesignCon 40 Under 40 engineer.
