ADHESIVE SELECTION-Comprehensive data and application notes on several of the firm’s adhesive formulations is offered in a pair of selection guides. The company’s EPO-TEK Electrically Conductive Adhesive Selection Guide and its EPO-TEK Thermally Conductive/Electrically Insulating Adhesive Selection Guide are provided as a resource in selecting an adhesive. Among the formulations listed in the guide to electrically-conductive adhesives is the EPO-TEK H Series, a line of silver-filled epoxies used in mass production applications that can withstand the high temperatures imposed by wire bonding operations. The adhesives also cure quickly at relatively low temperatures and exhibit a long pot life. The most popular product is EPO-TEK H20E, which is used by semiconductor manufacturers to attach chips to substrates and is an alternative to eutectic die-attach techniques.