Conductive Adhesive Vies With Solder For SMT Line Work

    June 1, 2000
    A new single-component, thermosetting, electrically-conductive adhesive claims to provide a lead-free alternative to solder for forming SMD interconnects. Called CE 3103, the adhesive offers an ultra-fine resolution (

    A new single-component, thermosetting, electrically-conductive adhesive claims to provide a lead-free alternative to solder for forming SMD interconnects. Called CE 3103, the adhesive offers an ultra-fine resolution (

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