A cooling solution for Rambus RIMM modules is available in the form of gel-based interface materials and a heat-spreader plate. The HeatPath GTQ-HS2-R100 heat spreader and GTQ-R100 interface materials have been shown to provide exceptionally low thermal resistance and minimal mechanical stress on components. They offer inherent surface wetting and softness properties. The heat-spreader plate meets Intel’s requirements for 1.25” RIMM modules and is offered in a range of colors and with custom logos. The thermal interface materials are soft and highly compressible to accommodate a range of gaps, tolerances and uneven surfaces. They’re available in a range of thicknesses from 0.25 to 1 mm. The material consists of an alumina-filled silicone gel with excellent thermal conductivity of 1.1 W/m°K.
Company: RAYCHEM CORP. - Electronics OEM Components Division
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