Interconnect Platform Challenges Solder Balls And Plated Vias

May 3, 2007
The MicroPILR interconnect platform, a unique technology that addresses interconnections within semiconductor packages, substrates, PCBs, and other components, employs low-profile, pin-shaped contacts that replace conventional technologies such as

The MicroPILR interconnect platform, a unique technology that addresses interconnections within semiconductor packages, substrates, PCBs, and other components, employs low-profile, pin-shaped contacts that replace conventional technologies such as solder balls on ICs and plated vias in package substrates and PCBs. The technology has proven itself in the creation of an 8-die flash package stack that measures less than 1.2-mm thick. Each individual package can be tested prior to stacking, resulting in near 100% stacked yield. MicroPILR pins can be formed directly onto substrates and are typically nickel-/gold-plated copper. They currently range from 25 to 175 µm in height and 40 to 200 µm in pin-tip diameter, with height and diameter dimensions varying depending on application. For more information, call TESSERA TECHNOLOGIES INC., San Jose, CA. (408) 894-0700.

Company: TESSERA TECHNOLOGIES INC.

Product URL: Click here for more information

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!