iPhone Drops The BOM

How does Apple improve on cutting-edge technology? Check out the 3G iPhone's bill of materials (BOM), released by iSuppli.

July 15, 2008

Component Suppliers for the iPhone 3G Based on Physical Teardown
Preliminary Table provided by iSuppli Corp.

Supplier	Component Description
Source Unidentifiable	Display
Source Unidentifiable	Touchscreen
Toshiba Semiconductor	NAND Flash Memory, 8 GBbyte
Infineon	Baseband: HSDPA/WCDMA/EDGE, Dual ARM926 & ARM7Core
Samsung Semiconductor	Application Processor
Source Unidentifiable	Camera Module
Micron Technology	Image Sensor: 2 Megapixel; CMOS
Murata	Contains Marvell 88W8686 WLAN; CSR BC6 ROM Bluetooth
Samsung Semiconductor	SDRAM: Mobile DDR, 1 Gbit
Source Unidentifiable	Battery
Infineon	RF Transceiver: Quad-Band GSM/EDGE, Tri-Band WCDMA/HSDPA, 130-nm RF CMOS
Numonyx	128-Mbit NOR Flash; 64-Mbit pSRAM
Infineon	GPS Receiver: Single Chip
Infineon	Power Management IC: Phone
NXP Semiconductors	Power Management IC: Applications Processor
Broadcom	Multitouch Controller
Wolfson Microelectronics	Audio Codec
Skyworks	Power Amplifier: Quad-Band GSM/EDGE
STMicroelectronics	Accelerometer: Microelectromechanical
TriQuint Semiconductor	Power Amplifer Module (PAM): WCDMA/HSUPA
TriQuint Semiconductor	PAM: WCDMA/HSUPA
TriQuint Semiconductor	PAM: WCDMA/HSUPA
National Semiconductor	Mobile Pixel Link: 24-Bit RGB Display Interface Serializer
Linear Technology	Battery Charger: USB Compatible
Linear Technology	DC-DC Converter - Synchronous Boost
Infineon	Amplifier: LNA, Tri-Band HSDPA
Silicon Storage Technology	Flash: NOR, 8 Mbit
Infineon	Amplifier - LNA, GPS
Linear Technology	Regulator: Switching
Maxim	Analog IC