The performance of micro-electronic circuitry is said to be significantly increased through use of a new plated copper-on-thick film (PCTF) technology. The technology combines copper-plated images with air-fireable thick films on ceramics for the manufacture of metalized ceramic substrates, chip carriers, and packages that are said to be smaller in size and higher in circuit density and thermal and electrical performance. The PCTF technology employs thick-plated copper from 0.001" to 0.01" in thickness, thick-film lines to 0.002", copper-plated through holes and castellations, solid-metals plugs (thermal vias), multi-layers, and integrated resistors, capacitors and inductors. Compatible with all common assembly methods, fully assembled PCTF substrates can withstand thermal cycling from -65°C to 150°C and can operate at temperatures up to 200°C.
Company: REMTEC INC.
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