Molex recently integrated orthogonal direct configuration into its Impel backplane connector system, eliminating the midplane for direct connection of PCBs. The open-flow architecture helps improve channel performance, which in turn reduces costs. The Impel connector technology features a tightly coupled differential-pair structure for optimal signal integrity and mechanical isolation. Two compliant pin-attach options and 18 to 72 differential pairs per orthogonal mode offer further optimization. The connectors are available in multiple pitch options, including 1.90 mm broad-edge-coupled, 2.35 mm orthogonal, and 3.00 mm quad-route. Use of the company’s Temp-Flex twinax 30 AWG wires provides a full channel-to-channel solution for telecom and datacom applications.