Packaging & Interconnects: D-Subminiature Connectors Boost Environmental Performance

Nov. 29, 2004

The WD series of D-subminiature connectors features improved environmental protection per IP67 ratings thanks to its unibody construction, which eliminates the need to add sealants. This allows for rapid connector manufacturing. It also lowers cost and improves operation since concerns about differences in coefficients of expansion for dissimilar materials are negated. The connectors are available in nine-contact male and female variants and a 25-contact female, as well as in a 26-position female high-density variant. Contacts are rated for 7.5 A (size 20) and 5 A (size 22). A nine-position male connector costs $6.68 each in 1000-unit lots.

Positronic Industries Inc.www.connectpositronic.com; (417) 866-2322, ext. 2242

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.