The PCI Industrial Computer Manufacturers Group (PICMG) has approved and released three new CompactPCI specifications: PICMG 2.0 R3.0, an update of the core CompactPCI specification; PICMG 2.10 R1.0, Keying of CompactPCI Boards and Backplanes; and PICMG 2.11 R1.0, CompactPCI Power Interface.
"The new CompactPCI specifications are important because of the support they provide for enhanced I/O performance, system management, and redundant power supplies," said Richard Somes of the Embedded Systems Division of Smart Modular Technologies, Fremont, Calif. Somes also is PICMG's vice president for technology.
Revision 3.0 of the CompactPCI core specification incorporates features from PICMG's Hot Swap and Computer Telephony specifications, such as pin sequencing. It also adds 66-MHz operation with up to five peripheral slots, support for Hot Swap at 3.3-V signaling levels, and a reservation of pins for system-management functions.
PICMG's Keying specification was created to deal with overlapping functions of CompactPCI's user-definable pins, where use of the keying mechanisms—defined in IEC 61076-4-101 for the J4/P4 connector and in IEEE 1101.10 for handle and cardguide hardware—will be required. It provides a single reference document and reduces the risk of duplicated use. The PICMG Technical and Executive Committees will centrally administer assignment of these keys.
The CompactPCI Power Interface specification defines the electrical and mechanical requirements of 3U and 6U form-factor plug-in power modules. It covers the functionality and interoperability of these modules in CompactPCI systems.
The three specifications received approval on Oct. 1, 1999, by votes of the organization's executive membership. For information about PICMG membership, levels, and privileges, or to find out how to obtain PICMG specifications, visit the PICMG web site at www.picmg.org. Or call PICMG headquarters at (781) 246-9318.