EE Product News

Thermal Interface Material Made Thinner

This thin, highly compressible thermal interface material is suited for filling air gaps between heat generating devices and heatsinks, heat spreaders, and metal chassis. Measuring 0.010" thick, the Polarchip CP7500 interface material is said to be useful in applications where there are surface irregularities and where low stress on components is required. Additionally, the material passes Bellcore silicone specs. A pressure-sensitive adhesive can be laminated to one side of the CP7500 matereial to facilitate attachment. The thermal interface material is a composite material consisting of an expanded polytetrafluoroethylene matrix filled with boron nitride particles. The low elastic modulus of ePTFE matrix imparts softness, conformability and compressibility to the composite, while the high thermal conductivity of the boron nitride particles gives the composite thermal transport characteristics. Typical applications include telecommunications, wireless infrastructure equipment, optical modules, and consumer electronics. Pricing is $0.10/sq. in. in high volumes. W.L. GORE & ASSOCIATES INC., Newark, DE. (800) 445-4673.


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