Master Bond Toughened, One Component Epoxy Features High Glass Transition Temperature

Key Features

  • Convenient handling
  • Paste consistency
  • Resists thermal cycling
  • Passes NASA low outgassing
  • Good physical strength properties
  • Toughened system; fits well for bonding dissimilar substrates
  • High glass transition temperature

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room temperature. Supreme 17HTND-2 is thermally stable, featuring a high glass transition temperature (Tg) of 410°F (210°C). It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HTND-2 has reliable electrical insulation properties with a volume resistivity exceeding 1015 ohm-cm at 75 °F. It possesses high bond strength properties with a lap shear strength of 1,900-2,100 psi and a tensile strength of 7,000-8,000 psi. It is designed to withstand thermal cycling and offers a wide service temperature range from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, it has a paste consistency and is completely non-drip, making it ideal for applications where no flow is critical.
Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours, followed by a post cure at 350°F for 8-12 hours. It bonds well to a wide variety of substrates including metal, ceramics, composites and several plastics. Black in color, Supreme 17HTND-2 can be considered for specialty bonding/sealing applications where convenient processing, high temperature resistance and the ability to withstand thermal cycling are important factors.

Request More Information

By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.